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end-to-end hybrid bonding solution
to accelerate the deployment of 3D/
heterogeneous integration.”
Since the interface in hybrid
bonding is solid-state, with
embedded metal pads to allow for
face-to-face electrical connection
of wafers and dies, D2W hybrid
bonding requires similar tight cleanliness standards and manufacturing
tolerances seen in front-end semiconductor manufacturing processes.
This trend is also moving high-precision metrology into a more central
role in controlling hybrid bonding
alignment and process yield, which
in turn is driving the integration of
D2W bonding and metrology processes into one process line.
In addition, several different
D2W hybrid bonding process
flows are under evaluation today,
each with unique advantages and
requirements. Since its establishment two years ago, EVG’s
HICC has played a key role in
helping customers and partners
develop and optimize D2W hybrid
bonding processes to address the
unique needs of their given device
design and application, taking into
account various factors such as die
size, die thickness, total stack height
as well as interface considerations
such as contact design and density.
The HICC also features a state-ofthe-art cleanroom with cleanliness
standards on par with many
leading-edge semiconductor fabs —
enabling EVG to uniquely support
the stringent requirements for D2W
and W2W hybrid bonding process
development.
“The HICC has firmly established
itself as a preeminent central openaccess incubator for novel process
Busch Opens New Vacuum
Pump Service Facility
Busch Vacuum Solutions U.S., one of
the largest manufacturers of vacuum
pumps, blowers, compressors, and
systems globally, opened a new
service facility recently to meet the
needs of their medium-high vacuum
and industrial customers.
The remodeled 19,000 sq.
ft. service facility serves the
Northeastern vacuum equipment
market enabling Busch to provide
rapid service, support, and customer
training. It is the company’s third
service center for the semiconductor
industry and seventh for industrial
customers. The east coast location of
this new service center complements
Busch’s existing semiconductor
service centers in Austin
and Portland as they
continue to expand their
footprint servicing the
semiconductor market.
The new service center is at
2450 Boulevard of the Generals,
Norristown PA 19403, phone 484690-7200. It can handle a variety of
vacuum equipment including other
brands for customers on the east
coast.
Turgay Ozan, President of Busch
LLC said, “The relationship with
our customers does not end with
equipment installation. Making
sure they have a highly efficient
and reliable vacuum supply is our
solutions such as D2W hybrid and
fusion bonding,” stated Markus
Wimplinger, corporate technology
development and IP director at EV
Group. “State-of-the-art cleanrooms
at EVG’s headquarters in Austria,
as well as in our subsidiaries in
the US and Japan, guarantee that
hybrid bonds can be developed
with the highest possible yield.
At the same time, our world-class
development facilities outfitted
with our extensive portfolio of fully
automated process solutions offers
process development that is as agile
and close to series production as
possible. Our expertise in diverse
bonding technologies, as well as
process integration and metrology,
allows our customers and partners
to develop differentiated total solutions that can be easily transferred
to their production facilities.”
top priority.” Ozan also
added, “The Pennsylvania
facility demonstrates our
commitment to providing
the best possible customer
support for the growing Northeast
and mid-Atlantic markets.”
The service center features a
fully exhausted disassembly area,
blast room, and overhead visual
production planning to track flow
line activity. By implementing the
Lean Flow Production Concept, a
first pass yield of defect-free vacuum
pumps, with on-time delivery results
in better efficiency. Further information about Busch can be found at
www.buschusa.com.
16 | Tuesday, July 12www.semiconductordigest.com