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sponsored by
HORIBA
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copy for molecular structure and
composition.
• Photoluminescence for defects
and impurities.
Because the measurements are
non-destructive and the wafer handling is automated, Xtrology can
run film thickness, composition
and defect analysis in a single tool,
work that would otherwise call for
separate instruments. The system
connects to open cassette, SMIF and
FOUP interfaces and is designed
for both legacy and leading-edge
processes, for both silicon and
compound semiconductor devices.
HORIBA develops the sensors and
software itself, which the company
says simplifies maintenance and
long-term support.
Measurement as a
sustainability tool
Figure 3. HORIBA’s Xtrology
integrated thin film inspection
system combines multiple inhouse sensors with an automatic
conveyance system for nondestructive wafer inspection.
The common thread across all three
products is control. Tighter gas
delivery, continuous chemical monitoring and inline film inspection
all help fabs catch drift earlier, cut
scrap and rework, and use materials
and energy more efficiently, which
is the link HORIBA draws between
measurement and its “sustainable
tomorrow” theme.
HORIBA will have experts on
hand at booth #1733 throughout
SEMICON West.
Chemical-Resistant Coatings:
A Critical Defense for Semiconductor Fabs
Preventing corrosion, contamination and costly operational disruptions.
T I M M c D O N O U G H , C o n s t r u c t i o n S o l u t i o n s E x e c u t i v e ; MARK WAFFORD, C o n s t r u c t i o n
S o l u t i o n s E x e c u t i v e ; a n d LAURA ADAMS-KEIE, M a r k e t S e g m e n t M a n a g e r – S e m i c o n d u c t o r ,
Sher win-Williams Protec tive Coatings
Semiconductor manufacturing depends on precision at
every stage of production. Cleanroom environments,
sophisticated equipment and highly controlled processes
are designed to eliminate variables that could compromise
product quality. Yet one persistent threat exists throughout
fabrication facilities: corrosion. Left unchecked, corrosion
can damage assets, generate contaminants and increase
the risk of costly operational interruptions.
Because semiconductor facilities routinely handle
aggressive acids, solvents, cleaning agents and process
chemicals, facility infrastructure must be engineered to
withstand harsh exposure conditions. Chemical-resistant
coating (CRC) systems play a key role in protecting
structures, flooring and containment areas from degradation while helping facilities maintain production
efficiency, environmental control and long-term
profitability.
22 | Tuesday, October 13
Corrosion risks abound
Corrosive exposures can affect virtually every component of a fabrication facility, including process
equipment, storage vessels, structural steel, concrete,
walls, ceilings and floors.
The consequences can be significant. Corrosion
can weaken infrastructure and increase maintenance
requirements, adding operating expenses and unplanned
downtime.
Chemical spills and leaks are another concern. If secondary containment systems deteriorate due to chemical
attack, facilities face a greater risk of damage to surrounding structures and potential safety hazards.
Investing in protective coating systems is therefore a
proactive strategy for protecting production continuity
and reducing lifecycle costs.
Continued on page 23
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