ShowDaily Day1 - Flipbook - Page 16
sponsored by
Bechtel
continued from page 15
semiconductor industry. We’re building
digital capabilities, workflows and integrations to establish the foundation for
digital design for the next decade plus.”
Smith said digital integration and data
intelligence is particularly critical in the
semiconductor industry now, more so
than ever before. “It has to do with the
scale and the complexity of the projects
that we’re seeing come online and that
we’re working on right now,” they
said, noting that over $100 billion in
construction spending is forecasted to
occur over the next five years. “It’s not
just more and more projects and more
and more money; each of these projects
is becoming increasingly bigger and
more complex. I would argue that the
increasing scale and complexity of
these projects is fundamentally driving
the imperative of digital integration.
We need consistent, integrated, real
time and transparent execution of these
projects for our EPCs and for our owner
operators,” Smith said.
Smith said there’s an incredible
opportunity for repeatability in fab
construction. “The goal would be that
— if you have that digitally integrated
environment and data transparency
— to carry that intelligence from mod
to mod to mod.” Smith expects it could
result in time schedule and efficiency
gains similar to what Bechtel has
experienced in the liquified natural
gas industry (where we’ve seen gains
approaching 40%).
At SEMICON West this year,
Smith will be a panelist on the CXO
Panel “Can AI/GenAI + Digital
Twin Make Semiconductor Factory
Construction Smarter?”, to be held
Wednesday from 1:00-2:00pm on the
Smart Manufacturing Pavilion Stage
in the North Hall.
Busch Group Companies Announce Joint
Presence at Semicon West
The three companies of the Busch Group
turbomolecular vacuum pump, the ASM
(Busch Vacuum Solutions, Pfeiffer
392 from Pfeiffer Vacuum is SEMI S2
Vacuum and centrotherm clean solutions)
compliant and optimized for rapid pump
announce their joint presence at Semicon
downs and short response times on large
West 2024. This marks a significant miletest objects. Its dry, frictionless backing
stone, as it will be the inaugural occasion
pump and a powerful high vacuum pump
that the Busch Group exhibits collectively
make it ideal for testing in clean room
in one booth (#733) in the US.
environments.
Visitors of the Busch Group booth can
Series E electric valves: Being unveiled
expect an impressive showcase of vacuum
at the show for the first time, Pfeiffer
technology and gas abatement systems
Vacuum’s Series E is a groundbreaking
designed for supporting semiconductor
electric angle valve line designed for easy
Magnetically levitated
fabs and sub-fabs. The in-booth messaging
integration into high vacuum applications.
turbopumps from Pfeiffer
is “Ultimate Product Range” and “Total
Combining advanced electric actuation
Vacuum
Fab Solutions.” Turgay Ozan, President
with energy efficiency, Series E offers
and General Manager Busch Vacuum
superior control, reliability, and cost
Solutions & Pfeiffer Vacuum, comments: “We’re
savings.
uniquely positioned to be the premier full-solutions
ATH 2804 M turbopump: With a compact footprint,
partner to the semiconductor industry. Our extensive
Pfeiffer Vacuum’s ATH 2804 M magnetically leviproduct range supports everything from the clean room
tated turbomolecular vacuum pumps provide high gas
to the sub-fab. The range covers gas abatement systems,
throughput and are ideal for semiconductor manufacvacuum pumps, contamination management, leak
turing processes.
detection, valves, sub-fab management, and service for
HiPace 3400 IT turbopump: The HiPace 3400 IT,
all brands.”
designed exclusively for demanding ion implantation
applications, sets the standard as the most compact turRange of vacuum and abatement solutions
bopump in its class. The DN 320 flange size increases the
Continued on page 17
ASM 392 mobile leak detector: With its integrated
pumping speed for process gases by
16 | Tuesday, July 9
www.semiconductordigest.com
