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SEMI and Semiconductor Digest Announce
2022 Best of West Award Finalists
SEMI and Semiconductor Digest
today announced finalists for the
Best of West award to be presented
at SEMICON West 2022, July
12-14 at the Moscone Center in
San Francisco. The Best of West
Award winner will be announced
at SEMICON West 2022 Hybrid on
Wednesday, July 13, 2022.
Presented by SEMI Americas and
Semiconductor Digest each year, the
Best of West award recognizes innovative new products or services that
are significantly advancing the electronics manufacturing supply chain or
a particular manufacturing capability.
The following Best of West 2022
finalists will showcase their products
on the SEMICON West 2022 Hybrid
show floor:
Advantest: V93000
EX Test Station
The EX Test Station is a stand-alone
test system that is compatible with
Advantest V93000 series test systems.
It brings the versatility, accuracy, and
high-performance capabilities of the
V93000 into the lab environment.
ClassOne Technology: Solstice
ClassOne Technology’s
Solstice® single-wafer platform
delivers advanced electroplating
and wafer-surface preparation
technologies for compound
semiconductors and other critical
applications requiring ultimate
wafer uniformity and process
control in a single flexible, compact
system.
Nanotronics: nControl™
nControl™ integrates the
AIPC™ software solution with
its DLC™ edge computing for
manufacturing. AIPC™ aggregates
real-time manufacturing process
data and uses deep learning to
build models that provide KPI
predictions, anomalous activity
alerts and autonomous control,
enabling factories to automatically
adapt to increase yields and avoid
malfunctions.
The Best of West Winner will be announced on Wednesday of the show.
Onto Innovation: Atlas V
Atlas V, leveraging the latest improvements in source signal-to-noise
ratio (SNR), coupled with the Onto
Innovation AI Diffraction engine
(Machine Learning-guided modeling
engine), enables the clean separation
of signals related to nanosheets in
gate-all-around (GAA) devices. Using
individual nanosheet measurements
from an inline tool capable of measuring a single location in less than
a second, Atlas V enables a process
control feedback loop that is critical for
ramping yield to HVM levels.
UCT: IoT Manifold
The IoT Manifold is an innovative
concept that combines high-quality
ultra-clean valves, remote control capabilities, sensing features and wireless
connectivity systems. The IoT Manifold
is designed to maximize control over
various systems and prevent human
error, breakdowns, and unnecessary
expenditures while enabling a safer
working environment.
EV Group Achieves Die-To-Wafer Fusion and Hybrid
Bonding Milestone with 100% Die Transfer Yield on
Multi-Die 3D System-on-a-Chip
EV Group (EVG), a leading provider
of wafer bonding and lithography
equipment for the MEMS, nanotechnology and semiconductor markets,
today announced it has achieved a
major breakthrough in die-to-wafer
(D2W) fusion and hybrid bonding
by successfully demonstrating
100-percent void-free bonding yield
of multiple die of different sizes from
a complete 3D system-on-a-chip
(SoC) in a single transfer process
14 | Tuesday, July 12www.semiconductordigest.com
